• Residue-free adhesive backing seals around BGA pads to prevent solder paste bleed
• Laser cut ensures precise aperture size
• Eliminates tedious stencil cleaning (Disposable)
• Conforms to the board surface (Flexible)
• Fold-up sides for easy placement and solder paste containment
• Low cost
• Packaged in a handy ESD safe carrying case

The CircuitMedic B8-475-2532-127 are 25 mm long rework stencils made of polymer film. The residue-free adhesive backing prevents solder paste bleeding and the disposable stencils are laser cut to ensure an accurate aperture size.